The Penn State College of Engineering has been given a multi-functional nScrypt 3Dn-450-HP 3D printer, courtesy of consumer electronics company TE Connectivity. The donated 3D printer, worth around $350,000, will be used by researchers to deepen their exploration of new additive manufacturing materials and processes, as well as to explore the use of 3D printing on high-power devices.
The 3Dn-450-HP is an industrial 3D printing system developed by Florida-based nScrypt. The machine is based on a pneumatic extrusion 3D printing technology and reportedly has the highest precision motion system on the market. The industrial printer is also compatible with a wide range of materials, including high-performance plastics and ceramic-based materials.
“This nScrypt printer will facilitate Penn State’s work in multi-material additive manufacturing with a particular focus on integration of metals, ceramics and polymers,” said Mike Hickner, a professor in Penn State’s Materials Science and Engineering Department. “We are interested in furthering additive manufacturing materials science in electronics, biomedical and defense applications.”
TE Connectivity, which has supported Penn State’s engineering department for over 30 years, marked the donation of the industrial 3D printing system with a visit to the College of Engineering. A group of TE engineers were given a tour of the Center for Innovative Materials Processing 3D (CIMP-3D) and the Millenium Science Complex. Notably, the company donated four 3D printers (worth $25,000) to Penn State’s Harrisburg campus.
“We are pleased to donate this tool and believe it will offer students access to advanced additive manufacturing capabilities as well as further faculty research,” commented Rod Martens, senior principal engineer and manager for TE’s Harrisburg Research Center. “Looking forward, we hope this will deepen our technical engagement with university faculty and expose Penn State students to career opportunities with TE.”
As stated, the new nScrypt 3Dn-450-HP system will be used by the university’s researchers to explore the use of new AM materials as well as the use of 3D printing for high-power devices in the electronics, biomedical and defense sectors.