EnvisionTEC and 3Shape Launch Solution for Mass Customized In-Ear Devices
EnvisionTEC, a global leader in 3D printers for the in-ear device and monitor market, and 3Shape, a global leader in 3D scanning and CAD/CAM software, today launch a new turnkey system for scanning, modeling and printing in-ear devices. The system enables fast, mass customized production of in-ear devices for hearing care.
At AudiologyNow! 2017, the world’s largest gathering of audiologists, the two companies will jointly demonstrate how scanning, software and 3D printers work together to deliver an elegant, quick, cost-effective custom solution for hearing care professionals and their patients. The event will be held from April 5-8 in the Indiana Convention Center and Lucas Oil Stadium.
“EnvisionTEC is proud to continue partnering with 3Shape to deliver an integrated solution to the in-ear device market. Together, our 3D technologies delivers fast, reliable, custom solutions to hearing care professionals and their patients every day,” said CEO Al Siblani.
EnvisionTEC and 3Shape will now offer a tightly integrated turnkey system to audiology professionals that includes the 3Shape H600 3D Scanner for fast, reliable and high accuracy 3D scanning of ear impressions, The 3Shape software package, also included, enables modeling of up to 6,000 files and managing 3D print jobs, including: EarMouldDesigner for modeling of BTE ear moulds and soft silicone BTE ear moulds, ShellDesigner for modeling of ITE type shells, with all components (transducer, receiver, volume control, battery, etc.) incorporated into the modeling process, and CAMBridge for efficient 3D print job management for clinics and small-to mid-sized manufacturers.
“Our partnership with EnvisionTec has enabled many labs to easily migrate from their old manual intensive process to a full CAD/CAM workflow. The combined technologies offer a proven digital solution” said Iain Mcleod, Business Unit Director
The full solution package also includes two 3D printers, these are either the EnvisionTEC Vida Hi-Res DSP, which offers a build envelope of 96 x 54 x 100 mm (3.78 x 2.13 x 3.94 in.) and XY resolution to 50 µm (0.002 in) or the EnvisionTEC Micro Plus Advantage, with a build envelope of 65 x 40 x 100 mm (2.36 x 1.77 x 3.94 in.) and XY resolution to 60 µm (0.0024 in. The An Otoflash curing unit, to post-cure 3D print jobs to the desired finish and a Training on the 3Shape scanner, software and 3D printer complete the offer.
