Mike Littrell, C.ideas CEO is the co-inventor of WAV technology and Founder of Paxis LLC. After first announcing last year, Littrel showed off the first product built with the not-yet-commercially-available process at the recent AMUG. It is a full-size surfboard which, as Littel reports, was 3D printed as a single part. The object looks solid and layer lines are almost invisible.
“The limitations of current Additive Manufacturing equipment highlights the need for: extremely large parts and large quantities of smaller parts at faster speeds…“WAV (wave) is an expandable platform with physical, modular upgrades. More material choices, all while utilizing less post processing and operation costs. WAV will change prototyping, investment casting, and manufacturing as we know it today.”
WAV technology appears to be truly disruptive and, if anyone other than Mike Littrell or a giant corporation, made all these claims we would generally dismiss them. However, Mike and his team are among the biggest experts of AM there are and few people know AM technologies and their applications as they do. This goes a long way toward making WAV technology one of the most awaited new high-speed AM processes – along with MJF, HSS, STEP, CLIP and others.
WAV technology is capable of producing parts much larger than traditional AM systems sold today. It requires a smaller footprint (per cubic inch volume) than any known Laser, Jetting or DLP based process. It can even fit through a standard doorway. Based on internal testing, the process is expected to have projected speeds* of 4x, 8x, 24x+ of the fastest large vat; (Laser, DLP or Jetted based Photopolymerization) systems. WAV has exponentially upgradeable speeds with modular hardware expansions, all while yielding a lower cost of operation.